Product line 1

Custom multilayer PCBs for AI compute

A custom multilayer PCB is a printed circuit board built to one customer's stackup, with copper layers separated by cores and prepreg of a named laminate and glass cloth. Tecsply Inc. supplies 8 to 40+ layer boards up to 6.0 mm thick for AI accelerators, cluster switches and rack power, specified layer by layer and built by partner fabricators in Taiwan, Japan and Southeast Asia.

Last reviewed Tecsply Inc. engineering

What we build

Tecsply builds rigid multilayer PCBs from 8 to 40+ layers and up to 6.0 mm finished thickness, in six construction families. Each board is quoted from a signed stackup that names the laminate, glass style and copper weight of every layer.

Construction families offered through Tecsply partner fabricators. Per-partner limits are listed on the partners page as they are verified.
ConstructionRangeTypical use
Rigid multilayer8–40+ layers · ≤ 6.0 mmAI baseboards, switches, backplanes
HDI1+N+1 to any-layerFine-pitch BGA breakout, substrate-like PCBs
Sequential laminationMultiple sub-coresBlind and buried vias, back-drill-sensitive channels
Low-loss laminate buildsM6 · M7 · M8 grade56G, 112G and 224G PAM4 channels
Low-CTE reinforcedT-glass / NE-glassPackages over 60 mm, thick boards
Heavy copper2–6 ozRack power shelves, busbar boards

Specified from the stackup up

Every Tecsply PCB starts from a stackup in which each of the board's cores and prepreg layers is named by laminate family, glass type, glass style and ply count. The cross-section below shows the structure: copper foil on the outside, etched cores inside, prepreg bonding them, and a plated through-hole running the full thickness.

12-layer stackup cross-section: copper foil layers separated by cores and prepreg, with a plated through-hole. L1L2L3L4 L5L6L7L8 L9L10 PPCore PTH · Cu barrel
■ Copper foil · ▦ Prepreg (glass + resin) · ▬ CCL core Section shown: 10 of 12 layers, not to scale

Two material decisions set most of a high-speed board's behavior: the copper clad laminate loss grade, and the glass cloth inside it. Dielectric thickness per layer follows from the glass style and resin content. The stackup calculator and loss budget estimator let you test a construction before the review.

Where the boards go

Tecsply multilayer PCBs serve 2 markets with different first limits: AI compute boards are limited by channel loss and package warpage, and aerospace boards by z-axis expansion and IPC-6012 Class 3 reliability.

What ships with every board

Every Tecsply PCB order ships with 4 records: the signed stackup, a material declaration down to glass style, copper weight and copper foil grade, inspection records to the specified IPC-6012 class, and country-of-origin records for the board, the laminate and the copper foil.

Send the board, not just the Gerbers

Share the fastest lane rate, largest package, operating environment and annual volume; we return a stackup with named CCL and glass constructions and a landed DDP price, usually within five business days.