Three product families, one division
The division covers three families of custom metal hardware. Thermal parts and enclosures go into AI servers, data-center power and edge computing. Aerospace machined parts go into aircraft, engine, space and defense programs. All three are quoted from a named material specification and built to the customer's drawing.
| Family | What we supply | Where it is used | Material examples |
|---|---|---|---|
| Thermal management | Custom heat sinks, liquid cold plates, coolant manifolds | AI accelerators and servers, power electronics, 800 V DC power shelves | Aluminum 6061 / 6063; copper C11000 / C10100 |
| Enclosures and chassis | Server and storage chassis, power-shelf and PDU enclosures, rack-mount and rugged edge-computing enclosures, copper busbars | AI racks, data-center power distribution, edge and defense computing | Steel and aluminum sheet; copper C11000 / C10100 busbars, tin or silver plated |
| Aerospace machining | Titanium, aluminum-lithium and nickel-superalloy parts machined to print | Aircraft, engine, space and defense programs | Ti-6Al-4V; Al-Li 2050 / 2195; Inconel 718 / 625. See aerospace alloy parts |
Delivered as one mechanical subassembly
When a program needs them together, the heat sink or cold plate, the enclosure and the copper busbars are delivered as one subassembly under one part number, fitted and inspected before it ships. The receiving line installs one item instead of reconciling tolerances between three suppliers, and one drawing revision governs the whole assembly. Each part can also be ordered on its own, from a single prototype to scheduled production releases.
Why PCBs are quoted separately
PCBs are supplied by Tecsply's PCB division as a separate line item. Bare boards ship to your EMS for SMT and through-hole assembly, while the mechanical subassembly ships to your system integration line. The two are usually specified by different engineers and bought by different commodity teams, so each gets its own quote, drawing revision and inspection record. One Tecsply contact can coordinate both when the same program needs them; see custom multilayer PCBs.
Why thermal and enclosure hardware is in short supply
US data-center capacity stood at about 62 GW in March 2026 and is forecast to reach about 118 GW by 2030, so roughly as much capacity again has to be built, cooled and powered within four years. At rack level, NVIDIA's 800 V DC power rack was expected to begin customer shipments in the third quarter of 2026, with wider adoption after the Rubin Ultra generation in the second half of 2027. That moves power shelves, busbars and liquid cooling into new enclosure designs, and new designs need suppliers who can review a drawing and hold it from first article to production.
Engineering review and records
- Engineering review before the quote. Every drawing is reviewed for material, finish, flatness of thermal contact surfaces, plating and inspection requirements before a price is issued, and manufacturability questions go back to your engineer.
- First article. First-article inspection in AS9102 format when the program requires it; production lots follow the same routing.
- Records with every shipment. Material certificates naming the alloy, temper or copper grade, plating and finish certifications, dimensional inspection results, and pressure or leak-test records for liquid-cooled parts when the drawing calls for them.
- Origin. Every Tecsply product, from multilayer PCBs to machined metal parts, is manufactured in a non-restricted country specified by the customer.
What to send with a request
A request with these 6 items can usually be quoted without a call.
- Drawing or 3D model with revision and tolerances.
- Material and finish, for example 6063 aluminum, C11000 copper with tin plating, or Ti-6Al-4V to AMS 4928.
- Thermal requirement for heat sinks and cold plates: heat load, coolant and flow rate, allowable pressure drop and maximum case temperature.
- Assembly level: individual parts, or the heat sink, enclosure and busbars as one subassembly.
- Quantity and delivery schedule, from prototype to production releases.
- Program flow-downs: country-of-origin requirements, DFARS 252.225-7009, ITAR, AS9102 first article.
Division FAQ
Three questions buyers ask first; aerospace alloy questions are on the aerospace alloy parts page.
What does Tecsply's Thermal, Enclosures & Aerospace Machining division supply?
The Thermal, Enclosures & Aerospace Machining division of Tecsply Inc. supplies custom metal hardware made to a customer's drawing in three families: thermal management parts (custom heat sinks, liquid cold plates and coolant manifolds), enclosures and chassis (server, power-shelf, PDU, rack-mount and rugged edge-computing enclosures, plus copper busbars), and aerospace parts machined from titanium, aluminum-lithium and nickel superalloys. It is a separate division from Tecsply's PCB business, with its own engineering review, quoting and quality records.
Can Tecsply deliver the heat sink, enclosure and busbars as one assembly?
Yes. When a program needs them together, the heat sink or cold plate, the enclosure and the copper busbars are delivered as one mechanical subassembly under one part number, fitted and inspected before it ships, so the receiving line installs one item instead of reconciling tolerances between three suppliers. Each part can also be ordered on its own.
Are PCBs included in a thermal or enclosure order?
No. PCBs are quoted separately by Tecsply's PCB division. Bare boards ship to the customer's EMS for SMT and through-hole assembly, while the mechanical subassembly ships to the system integration line, and the two are usually specified by different engineers and bought by different commodity teams. Each therefore gets its own quote, drawing revision and inspection record; one Tecsply contact can coordinate both when the same program needs them.
Send the drawing and the material
We return a quote with the material source, finish, inspection plan and, for liquid-cooled parts, the test plan.
References
- S&P Global Market Intelligence (451 Research), US data-center capacity, March 2026 and 2030 projection.
- BloombergNEF, US data-center capacity outlook, July 2026: 118 GW installed by 2030.
- TrendForce, NVIDIA 800 V power rack shipment timing, June 2026.
- DFARS 252.225-7009, Restriction on Acquisition of Certain Articles Containing Specialty Metals (acquisition.gov).