Status by material
Every row below comes from public industry reporting with the source linked; it describes the market, not a quotation or a Tecsply allocation.
Updated . Market status from public reports, not a quotation.
| Material | 2026 status | Lead time | What it means | Sources |
|---|---|---|---|---|
| Low-loss CCL, M6 to M8 | Allocated under quota systems | 8–16 weeks (mid-2026); 14–18 weeks for advanced grades (Aug 2026); up to about 6 months at the March 2026 peak | Confirm allocation before a stackup is frozen; new M7/M8 capacity is booked by AI server, switch and satellite customers. | DIGITIMES, Mar 2026 NextPCB, 2026 Atlas PCB, Aug 2026 |
| M9-class CCL | Early volume; reserved by the largest buyers | Up to about 140 days (mid-2026) | Makers report M9 certification with volume from the second half of 2026; interim 'M8+' constructions upgrade only the glass, foil or resin. | NextPCB, 2026 CTEE, Nov 2025 |
| Low-Dk glass cloth | Short | Relief not expected before new capacity in the second half of 2027 | Nittobo holds over half of high-end cloth; Taiwan Glass is expanding high-end lines. 7628 cloth was up about 140% from Q3 2025 by August 2026. | UDN, 2026 TechNews, Jan 2026 Atlas PCB, Aug 2026 |
| T-glass (low-CTE cloth) | Allocated; Nittobo about 90% of supply | New Nittobo capacity from mid-2027 at the earliest | Qualifying alternatives: Taiwan Glass and Fulltech low-CTE cloth (shipping in small volume), AGY L-HDI in the US (customer qualification). T-glass controls warpage, not loss. | TrendForce CTEE, May 2026 CompositesWorld, Feb 2026 |
| HVLP4 copper foil | Shortfall about 1,500 t in 2026, widening to about 2,500 t in 2027 | 6–8 months from overseas makers | Three makers hold 80–90% of high-end supply; qualifying a new foil source takes 6–12 months at the customer after the maker's own ramp. | PCBA-HYH, Jul 2026 DIGITIMES, Jun 2026 |
| PCB drill bits | Short for high-layer AI boards | Capacity expanding through 2027 | Harder low-loss materials cut hits per bit from about 3,000 to under 800, so high-end bit use rose more than sixfold. | CTEE, Mar 2026 |
How to use it when planning a stackup
Treat an allocated material as a lead-time risk rather than a reason to avoid it. For a channel that needs M7 or better, confirm allocation before the stackup is frozen and keep a qualified alternative from a second maker; the material advisor lists cross-vendor options with their plants and qualification time. Where warpage rather than loss drives the choice of T-glass, a symmetric, thicker core can sometimes relieve the need for it.
References
- DIGITIMES, TrendForce, CTEE (Commercial Times), UDN, TechNews, NextPCB, Atlas PCB and PCBA-HYH reporting, March to September 2026, linked in each row.