Send us the board, not just the Gerbers.

What to include in a PCB request

A request with 5 pieces of information, layer count, fastest lane rate, largest package, operating environment and annual volume, is enough for a first stackup recommendation without a call.

• Layer count and board size, or the current stackup if one exists.
• Fastest serial lane (for example 112G PAM4) and the longest channel length.
• Largest package on the board, with its body size.
• Operating environment: temperature range, IPC-6012 class, and whether the program is a 10 U.S.C. 4873 covered defense system.
• Annual volume and target first-article date.

Design data formats: Gerber RS-274X or Gerber X2 with Excellon drill files and an IPC-D-356 netlist, ODB++, IPC-2581, or an Altium 365 share link, together with the fabrication drawing and stackup as PDF.

For heat sinks, cold plates, enclosures and busbars, send the drawing, material and finish, the thermal requirement and whether you need one subassembly; see what to send for thermal and enclosure parts. For titanium, aluminum-lithium or superalloy parts, send the drawing or 3D model, the alloy and specification, the heat-treat condition, quantity, special processes and program flow-downs such as DFARS 252.225-7009; see what to send with a metal-part request.