Technology supply chain · United States
Tecsply Inc is a US supplier, based in Fullerton, California, with two divisions. High-Speed PCB supplies high-layer-count, low-loss multilayer boards for AI servers and aerospace. Thermal, Enclosures & Aerospace Machining supplies custom heat sinks, liquid cold plates, server and power-shelf enclosures, stamped galvanized-steel enclosures, computer cases, copper busbars, and titanium, aluminum-lithium and nickel-superalloy parts machined to print. Every order is quoted, built and documented to one material-level standard. Precise, rigorous execution, and keeping every commitment we make, is our product.
What we make
Every Tecsply part, whether a 40-layer AI baseboard, a liquid cold plate or a machined Inconel 718 bracket, is quoted from a named material specification, built to the customer's drawing and delivered with lot-level traceability.
High-Speed PCB division
Thermal, Enclosures & Aerospace Machining division
Why Tecsply
Tecsply builds every PCB and metal part to one customer's specification, from a single prototype to production lots, and backs every shipment with the same four commitments.
Every stackup and every drawing is reviewed for material, process and inspection requirements before we quote, and questions go engineer to engineer.
Named laminates, glass styles, alloys, heat-treat conditions and inspection plans, held the same from first article to production.
Prototypes, scheduled releases and expedited lots, with qualified alternates proposed for approval when material allocation is tight.
Stackups, material declarations, mill certificates, inspection reports and country-of-origin records, all tied to the same drawing revision.
Our position
A 24-layer AI accelerator baseboard carrying 112G PAM4 lanes is decided by its laminate and glass cloth, and an Inconel 718 engine bracket is decided by its alloy, heat-treat condition and melt source, before either one reaches a machine. Most quotes are priced from geometry and quantity. That works for commodity parts. It does not work for these, where the material choice sets loss, warpage, strength at temperature and program compliance.
Tecsply's role in the supply chain is to make the material decision explicit, document it, and hold our manufacturing partners to it lot by lot. We are an engineering-led supplier, not a broker: every PCB order carries a signed stackup and a material declaration down to the glass style and copper weight, every metal part carries its mill certificate and melt source, and both carry country-of-origin records.
US OEMs and contract manufacturers building AI training and inference hardware, data-center power and cooling equipment, high-speed networking, aircraft and engine structures, satellite and avionics hardware, and defense subsystems. Typical annual PCB spend of $0.5M to $5M, where an engineering-grade supply partner matters more than the cheapest unit price.
Markets
AI compute boards above 56G PAM4 are limited first by dielectric loss and warpage, while aerospace boards cycling between −55 °C and +125 °C are limited first by z-axis expansion and plated through-hole reliability. Each market has its own page with its own material table, compliance list and FAQ.
Very-low-loss and ultra-low-loss CCL for 112G and 224G PAM4, mixed NE-glass and T-glass stackups for packages over 60 mm, fiber-weave skew control, and heavy-copper power shelves.
AI compute PCBs → Aerospace and defenseBoards built to IPC-6012 Class 3 / 3A with high-Tg and polyimide laminates, plus machined titanium, aluminum-lithium and superalloy parts, all with lot-level country-of-origin records.
Aerospace PCBs →Engineering tools
The tools run in your browser: a stackup calculator, a channel loss estimator, a Gerber production-readiness pre-check, a material advisor and a defense compliance check. Files and results are sent only if you choose to send them; we count anonymous tool use. They prepare a quote conversation; they do not replace a fabricator engineering review.
Build a 4 to 100 layer stackup from copper weights and glass styles, get total thickness in mm and mil, the copper-to-dielectric split, and an aspect-ratio check against your smallest drilled hole.
Open the calculator →Estimate stripline insertion loss from 10G NRZ to 224G PAM4 for laminates from FR-4 to M9, split into dielectric and conductor loss, with copper roughness and a pass / marginal / fail check against your channel budget.
Open the estimator →Drop your Gerber, drill and netlist files, or a ZIP, to check file-set completeness, layer count, board size, finest copper feature, smallest drill and aspect ratio before you ask for a quote. Files never leave your browser.
Run the pre-check →Pick the laminate grade, copper foil and glass a 10G to 224G channel needs, with laminates from several makers, where they are made, 2026 availability and how long a substitution takes to qualify.
Open the advisor →Five questions about a defense or aerospace program: what to settle before sharing data, which rules such as 10 U.S.C. 4873 and DFARS specialty metals apply, and the documents we ship.
Run the check →Materials
Moving a signal layer from high-Tg FR-4 (Df above 0.02 at 10 GHz) to an M8-grade laminate such as Megtron 8 (Df 0.0016 at 14 GHz) cuts dielectric loss per centimeter by more than 10×, and replacing E-glass (CTE 5.6 ppm/°C) with T-glass (2.8 ppm/°C) halves the reinforcement's thermal expansion. Our three material guides explain how we make those choices.
CCL is the cured glass-and-resin core of every multilayer board, and its resin system sets Dk, Df, Tg and z-axis expansion. We classify laminates into six loss grades, from standard FR-4 above Df 0.010 to M8-grade ultra-low-loss below 0.002 at 10–14 GHz. Signal layers and plane layers are quoted as two separate material decisions.
Read the CCL guide →Glass type sets the cloth's Dk, loss and expansion; glass style sets its thickness and weave density. T-glass is the low-CTE, high-modulus family chosen when warpage, not loss, limits the design. Current AI baseboards increasingly combine low-Dk and low-CTE cloth in one stackup.
Read the T-glass guide →We classify cores and prepreg into four thickness bands, from ultra-thin 0.03–0.06 mm to thick 0.50–1.60 mm. Each band maps to glass styles, typical resin content and the layers it serves. The guide includes single-ply cured thickness for ten glass styles.
Read the thickness guide →Interactive
Seven application types, five lane rates and three package sizes map to the CCL loss grade, glass type, thin-dielectric glass style and layer-count band we would open the conversation with. It is a starting point for a stackup review, not a substitute for one.
Partner network
Tecsply's supply base is partner fabricators in Taiwan, Japan, Thailand, Vietnam and Malaysia, all located outside the four 10 U.S.C. 4873 covered nations. Spreading a program across more than one qualified origin protects it against tariff changes, defense origin rules and the capacity squeeze that AI server demand is putting on high-layer-count fabrication.
For defense and aerospace programs, every Tecsply product, from multilayer PCBs to machined metal parts, is manufactured in a non-restricted country specified by the customer, outside North Korea, China, Russia and Iran; see the current status of our defense sourcing.
| Country | Role in the network |
|---|---|
| Taiwan | Core of the network: high-layer-count, HDI and low-loss builds |
| Japan | Additional origin, next to much of the high-end laminate, glass and foil supply |
| Thailand | Second origin and added multilayer capacity |
| Vietnam / Malaysia | Additional origin diversification |
A stackup review with named CCL and glass constructions, a landed DDP price and a material lead-time estimate usually comes back within five business days when you share the target data rate, largest package, operating environment and annual volume.
References and data sources